The sector of console modding leads us to a couple extraordinarily spectacular initiatives, and a contemporary one we featured of be aware was once a transportable NES produced by means of [Redherring32]. It was once particular since the unique NES customized DIP chips were sanded right down to one thing like a surface-mount QFN bundle. Again when our colleague [Arya] wrote up the mission there wasn’t a lot knowledge, however since then the entire main points had been post in a GitHub repository. Possibly of maximum passion, it comprises a complete educational for the chip-sanding procedure.
To take irreplaceable vintage chips and sand them down should take some guts, however the premise is a legitimate sufficient one. Within a DIP bundle is a chip service and a internet of touch strips that pass to the pins, this procedure merely sands away the epoxy to reveal the ones strips for brand spanking new contacts. The outcome can then be reflowed as would occur with any QFN, and utilized in a brand new, smaller NES.
Alongside the best way this gives a captivating perception into DIP building that the majority folks by no means see. If any of you may have ever controlled to fatigue a pin off a DIP, you’ll additionally surely be considering how the method might be used to reattach a conductor.